Glass Processing – Efficient light management requires ultra precise surfaces

Therefore, Materion Balzers Optics is ever extending the limits of its polishing and glass handling capabilities. Our experience is based on the manufacturing of products where exceptional surface quality is essential. Further, Materion Balzers Optics applies semiconductor cutting technology on coated glass wafers. This is the way to provide cost effective high volume components with small dimensions.

Wafer Dicing and Scribing

The economical production of thin-film coating components often requires substrate wafer based processing. With advanced dicing and scribing capabilities, Materion Balzers Optics manufactures thin-film components to customer specific shapes and sizes with high precision.

Grinding & Polishing

The performance of any optical surface is highly dependent on the grinding and polishing process. Materion Balzers Optics constantly develops its in-house capabilities for these critical manufacturing steps. Based on our long-standing experience, we are able to identify the most economical solution for your specific application. Polishing quality is crucial for the performance of complex dielectric coatings as substrate roughness reduces transmission and blocking levels significantly. Materion Balzers Optics is able to produce its own high-quality substrates with excellent surface quality with a roughness in the range of a few tenths of a nanometer.

Faceting

Faceting helps to avoid the chipping of the workpiece edges in the subsequent manufacturing flow as well as in the final application. Our capabilities include manual as well as fully automated faceting for various workpiece geometries. Standard 45° chamfers as well as other shapes (e.g. C-shape) are available.