CCD/CMOS image sensors for digital photography and vision systems are packaged with individual cover lids or in a wafer level process with a coated 8’ or 12’ glass wafers.
Materion Balzers Optics offers a range of coating solutions for image sensor packaging including lids with antireflective coatings, NIR blocking filters or index-matched ITO.
A key factor of our cover lids and wafers are the superior low-defect properties of our optical coatings.
According to customer needs the cover lids can be provided with solderable GelotTM frames for device packaging or additional Chrome patterns as optical apertures or alignment features.
With our long expertise in substrate processing we are able to offer cover lid solutions for image sensors in a broad range of formats and substrate types, such as glass, borosilicate, sapphire, etc.
