CMOS or CCD sensor devices as applied in machine vision application or in optical consumer products require an effective protection of the light sensitive chip area by a transparent cover glass. Soldering is the assembly technology which provides best hermeticity values of such packagings. Gelot™ solderable coating gives the glass a surface which is well adhesive to solders such as gold or palladium. Gelot™ is applied to the lid in shape of a frame with a clear aperture. A customer-specific cutting-edge low defect coating can be added to the clear aperture, e.g. in the form of a high transmission bandpass filter for the visible spectral range combined with a broad NIR blocking.