CupLid Cavity Windows

For miniaturized packaging of photonic chips, including photodetectors, laser diodes, LEDs and MEMS mirrors, Materion Balzers Optics has developed CupLid Cavity Windows, a space-saving surface-mount photonic package.

CupLid Cavity Windows form a fineleak hermetic package by solder bonding a window cavity with a ceramic submount (alumina or AlN) under vacuum or inert gas atmosphere.

CupLids are available with various anti-refelective or filter coatings and can be shipped fully-furnished with tack-welded solder preforms (AuSn or SnSb) for easy handling and assembly. For prototyping we provide a number of reference designs of different AlN submounts for either wirebond or flipchip die-attach.