Low Defect Solutions for Optical Packaging – Silicon based devices such as MEMS, CCD/CMOS sensors or LCOS microdisplays are packaged with cover glasses

These cover glasses consist of clean surfaces plus functional coatings - such as AR coatings, NIR blocking filters or index matched ITO. Where needed chrome apertures can be provided, as well as solderable frames, B-stage epoxy frames or soldered Kovar lids as packaging solutions.

A key factor of Materion Balzers Optics' sensor lids is the superior low defect properties of the coatings as they define the quality of the device. Sealing or bonding solutions for the subsequent assembly process are an integral part of the products offered.

All Datasheets Lids / Windows

Brewster Windows

Brewster windows are designed to operate at an angle of incident. They transmit linearly polarized l... more

CorrSlide™

Correlative microscopy is a sophisticated approach combining the imaging capabilities of different p... more

Lids for Microdisplays

The optical performance of a microdisplay depends highly on the quality of its cover glass. It is no... more

NIR Bandpass Filters

NIR bandpass filters SP are used in various optical sensor applications. They block the visible ambi... more

CupLid Cavity Windows

For miniaturized packaging of photonic chips, including photodetectors, laser diodes, LEDs and MEMS ... more

Patterned Dichroic Filters

Multispectral image sensors require cover glass lids with integrated color-selective dichroic filter... more

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